At Micro Engineering Solutions, we are painstaking in our attention to detail, which you have to be when manufacturing parts with sub-micron tolerances. From the initial conceptual design all the way through to automated assembly, we analyze the stack up tolerances of each part of the product development process to ensure conformance with design intent and end user requirements.

We have considerable experience in designing automated micro assembly solutions, which have to combine extremely small parts into fully functioning, accurate, micro products that must have zero failure rates. This requires in-depth testing, inspection, and application knowledge to be successful, all of which is ingrained in the Micro Engineering Solutions team.

Each stage of a robust micro assembly process requires critical design, computational analysis, and expert execution to be successful. It is vital to place maximum effort in the planning stage as little room for error exists for changes later in the product development process due to the size, wall thickness, and geometry complexity of micro components and assemblies.

Micro Engineering Solutions recognizes that creating an efficient micro assembly and automation process requires strict adherence to tolerance control within the assembly. Building an assembly system for millions of parts takes careful planning and execution to guarantee micro and ultra precision assembly success.

Handling micro components is a challenge that requires not just high-speed automation systems capable of handling tiny parts, but also in-line metrology and vision systems to ensure form, fit, and function, and positional accuracy to sub-micron tolerances. 

At Micro Engineering Solutions, we attempt to minimize the extent of assembly required at the conceptual design stage, ensuring that products are designed with combined geometries if possible. Also, assembly can be reduced through the use of two shot or overmolding in some instances.

When assembly is necessary, Micro Engineering Solutions is experienced at using laser welding using beam sizes in the sub-micron and below size range allow pinpoint accuracy of multiple laser welds using a nano-positioning table or a multi-axis robot station mounted on an automation rotary or shuttle system.

In addition, when appropriate, we use ultrasonic welding with tiny (70-100 um) weld beads with custom low energy boosters and ultrasonic horns; solvent bonding (being careful to assess compatibility with various materials and issues if the device is to be implanted); and inexpensive progressive stamping dies that represent a moderately fast method for staking both polymers and metals together using a pressurized “folding” of one material into another.

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