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Micro Assembly

The preparation required for micro components at the design stage carries through all the way to automated assembly.  Because the tolerances are critical and diminishing to microns and sub-microns, the stack-up tolerances of the micro components and their design criteria are scrutinized and their method of manufacturing are also considered for long-term production.  The mechanics of micro assembly and the testing, inspection, application knowledge are required for fully functioning specks of dust working collaboratively and repeatedly.   Handling these components is a challenge requiring high speed automation capable of handling dust speck sized parts, in-line metrology and vision systems to insure form, fit, and function, and positional accuracy to sub-micron tolerances.  These joining/assembly methods include:

  • AVOIDANCE OF HANDLING- Combining geometry into the least number of parts in a micro assembly
  • TWO-SHOT MICRO MOLDING/OVER-MOLDING- Two-shot molding (2 injection barrels of two different materials) injecting into a mold at two different locations or in the same location with a rotating mold
  • LASER WELDING- Careful control of laser energy and power densities can be used to selectively clean and strip materials such as wires quickly and non-destructively.
  • ULTRASONIC WELDING-Very tiny (70-100 um) weld beads are possible with custom low energy boosters and ultrasonic horns.
  • SOLVENT BONDING-Appropriate solvents must be used that are compatible with the materials being solvent bonded, especially if the assembly is to be used as an implantable.
  • STAKING- Crimping or staking is a very common practice to generate good seals for preventing costly fluids from escaping the micro vessel.
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